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• Propagation delay time= 60 ns(typ)atCL =50 PF, VDD= 10V
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• Buffered inputs and outputs |
• Standardized symmetrical output characteristics |
• 100% tested for maximum quiescent current at 20V |
• 5-V. 10.V, and 15-V parametric ratings |
• Maximum input current of 1 μA at 18 Vover full package-temperature range:100 NA at 18 V and 25°c |
•Noise margin (over full package temperature)
1 Vat VDD=5V
2 Vat VDD= 10V
2.5 Vat VDD=15V |
• Meets all requirements of JEDEC TentativeStandard No, 13B, "standard Speclfleatlonsfor Description of"B"Series CMOS Devic" |
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CATALOG |
CD4001BM96 COUNTRY OF ORIGIN |
CD4001BM96 PARAMETRIC INFO |
CD4001BM96 PACKAGE INFO |
CD4001BM96 MANUFACTURING INFO |
CD4001BM96 PACKAGING INFO |
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COUNTRY OF ORIGIN |
Malaysia |
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PARAMETRIC INFO |
Logic Family |
CD4000 |
Logic Function |
NOR |
Number of Element Inputs |
2-IN |
Number of Element Outputs |
1 |
Number of Elements per Chip |
4 |
Number of Output Enables per Element |
0 |
Number of Selection Inputs per Element |
0 |
Output Type |
Push-Pull |
Process Technology |
CMOS |
Minimum Operating Supply Voltage (V) |
3 |
Maximum Operating Supply Voltage (V) |
18 |
Typical Operating Supply Voltage (V) |
3.3|5|9|12|15 |
Maximum High Level Output Current (mA) |
-4.2(Min) |
Maximum Low Level Output Current (mA) |
4.2(Min) |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
125 |
Supplier Temperature Grade |
Military |
Maximum Propagation Delay Time @ Maximum CL (ns) |
250@5V|120@10V|90@15V |
Absolute Propagation Delay Time (ns) |
250 |
Propagation Delay Test Condition (pF) |
50 |
Maximum Quiescent Current (uA) |
5 |
Typical Quiescent Current (uA) |
0.02 |
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PACKAGE INFO |
Supplier Package |
SOIC |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
14 |
Lead Shape |
Gull-wing |
PCB |
14 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
8.75(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.5(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
8.75(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC |
Package Family Name |
SO |
Jedec |
MS-012AB |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
96 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
Reel Diameter (in) |
13 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
16 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
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