IRLML6402TRPBF Infineon Technologies MOSFET P-CH 20V 3.7A SOT-23

label:
2023/11/20 246



• Ultra Low On-Resistance
• P-Channel MOSFET
• SOT-23 Footprint
• Low Profile (<1.1mm)
• Available in Tape and Reel
• Fast Switching
• Lead-Free
• RoHS Compliant, Halogen-Free


CATALOG
IRLML6402TRPBF COUNTRY OF ORIGIN
IRLML6402TRPBF PARAMETRIC INFO
IRLML6402TRPBF PACKAGE INFO
IRLML6402TRPBF MANUFACTURING INFO
IRLML6402TRPBF PACKAGING INFO
IRLML6402TRPBF ECAD MODELS


COUNTRY OF ORIGIN
China
Hong Kong
Israel
Malaysia
Philippines
Thailand
United States of America


PARAMETRIC INFO
Channel Type P
Channel Mode Enhancement
Configuration Single
Maximum Drain Source Voltage (V) 20
Material Si
Maximum Continuous Drain Current (A) 3.7
Maximum Absolute Continuous Drain Current (A) 3.7
Maximum Gate Source Voltage (V) ±12
Maximum Drain Source Resistance (mOhm) 65@4.5V
Typical Gate Charge @ Vgs (nC) 8@5V
Operating Junction Temperature (°C) -55 to 150
Maximum Power Dissipation (mW) 1300
Process Technology HEXFET
Minimum Gate Threshold Voltage (V) 0.4
Category Power MOSFET
Typical Gate to Drain Charge (nC) 2.8
Typical Output Capacitance (pF) 145
Typical Gate to Source Charge (nC) 1.2
Maximum Junction Ambient Thermal Resistance 100°C/W
Maximum Positive Gate Source Voltage (V) 12
Typical Input Capacitance @ Vds (pF) 633@10V
Typical Gate Threshold Voltage (V) 0.55
Typical Reverse Transfer Capacitance @ Vds (pF) 110@10V
Typical Reverse Recovery Charge (nC) 11
Maximum Diode Forward Voltage (V) 1.2
Typical Reverse Recovery Time (ns) 29
Typical Forward Transconductance (S) 6(Min)
Maximum Pulsed Drain Current @ TC=25°C (A) 22
Typical Turn-On Delay Time (ns) 350
Typical Turn-Off Delay Time (ns) 588
Typical Fall Time (ns) 381
Typical Rise Time (ns) 48
Maximum Gate Source Leakage Current (nA) 100
Maximum Gate Threshold Voltage (V) 1.2
Maximum IDSS (uA) 1
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150
Tradename HEXFET®


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 3
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3.04(Max)
Package Width (mm) 1.4(Max)
Package Height (mm) 1.02(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 3.04(Max)
Package Overall Width (mm) 2.64(Max)
Package Overall Height (mm) 1.12(Max)
Seated Plane Height (mm) 1.12(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-236AB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Shelf Life Period 3 Years
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Reel Width (mm) 8.4
Tape Pitch (mm) 3.9
Feed Hole Pitch (mm) 3.9
Hole Center to Component Center (mm) 1.95
Packaging Document Link to Datasheet


ECAD MODELS

Produs RFQ