|
|
| CATALOG |
HDSP-3901-EF000 PARAMETRIC INFO
|
HDSP-3901-EF000_PACKAGE INFO
|
HDSP-3901-EF000 MANUFACTURING INFO
|
HDSP-3901-EF000 PACKAGING INFO
|
|
PARAMETRIC INFO
|
| Type |
Module |
| Color |
Red |
| Number of LEDs |
8 |
| Number of Digits |
1 |
| Configuration |
Common Anode |
| Digit Size (in) |
0.8 |
| Peak Wavelength (nm) |
631 |
| Typical Intensity (ucd) |
10300 |
| Dominant Wavelength (nm) |
622 |
| Maximum Forward Voltage (V) |
2.5 |
| Maximum Forward Current (mA) |
40 |
| Maximum Reverse Voltage (V) |
3(Min) |
| Character Displayed |
Numeric |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
100 |
| Viewing Area Length (mm) |
11.07 |
| Viewing Area Height (mm) |
20.32 |
| Total Thickness (mm) |
8.38 |
| Maximum Storage Temperature (°C) |
100 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Power Dissipation (mW) |
100 |
|
|
PACKAGE INFO
|
| Supplier Package |
DIP Module |
| Pin Count |
13 |
| PCB |
13 |
| Tab |
N/R |
| Package Length (mm) |
27.94 |
| Package Width (mm) |
19.96 |
| Package Height (mm) |
8.38 |
| Package Diameter (mm) |
N/R |
| Mounting |
Through Hole |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Maximum Wave Temperature (°C) |
250 |
| Wave Solder Time (Sec) |
3 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
|
|
PACKAGING INFO
|
|
|
|
One-stop supplier of IC products