AD5272BRMZ-50 Analog Devices IC RHEOSTAT 5V 50TP 1024 10MSOP

label:
2023/11/20 193



• Single-channel, 1024-/256-position resolution
• 20 kΩ, 50 kΩ, 100 kΩ nominal resistance
• Maximum ±1% nominal resistor tolerance error
• 50-times programmable (50-TP) wiper memory
• Rheostat mode temperature coefficient: 5 ppm/°C
• 2.7 V to 5.5 V single-supply operation
•2.5 V to ±2.75 V dual-supply operation for ac or bipolar operations
• I 2C-compatible interface
• Wiper setting readback
• Power on refreshed from 50-TP memory
•Thin LFCSP 10-lead, 3 mm × 3 mm × 0.8 mm package
•Compact MSOP, 10-lead 3 mm × 4.9 mm × 1.1 mm package


CATALOG
AD5272BRMZ-50 COUNTRY OF ORIGIN
AD5272BRMZ-50 PARAMETRIC INFO
AD5272BRMZ-50 PACKAGE INFO
AD5272BRMZ-50 MANUFACTURING INFO
AD5272BRMZ-50 PACKAGING INFO
AD5272BRMZ-50 ECAD MODELS
AD5272BRMZ-50 FUNCTIONAL BLOCK DIAGRAM
AD5272BRMZ-50 APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
Philippines


PARAMETRIC INFO
Resistance Value (KOhm) 50
Number of Positions 1024
Number of Pot per Package 1
Memory Type Non-Volatile
Taper Type Linear
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Extended Industrial
Power Supply Type Single|Dual
Maximum Dual Supply Voltage (V) ±2.75
Maximum Single Supply Voltage (V) 5.5
Maximum Supply Current (mA) 0.001
Minimum Dual Supply Voltage (V) ±2.5
Minimum Single Supply Voltage (V) 2.7
Typical Single Supply Voltage (V) 5
Control Interface Serial (2-Wire, I2C)
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package MSOP
Basic Package Type Lead-Frame SMT
Pin Count 10
Lead Shape Gull-wing
PCB 10
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 3
Package Width (mm) 3
Package Height (mm) 0.85
Package Diameter (mm) N/R
Package Overall Length (mm) 3
Package Overall Width (mm) 4.9
Package Overall Height (mm) 1.1(Max)
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Micro Small Outline Package
Package Family Name SO
Jedec MO-187BA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 50


ECAD MODELS



FUNCTIONAL BLOCK DIAGRAM



APPLICATION
• Mechanical rheostat replacements
• Op-amp: variable gain control
• Instrumentation: gain, offset adjustment
• Programmable voltage to current conversions
• Programmable filters, delays, time constants
• Programmable power supply
• Sensor calibration
Produs RFQ